Skip to content Skip to footer

Chemical-mechanical polishing (CMP) is one of the most significant and direct effects on chip success. The capability to predict and minimize CMP variation in a design is crucial to achieving your yield goals. Model-based planarity analysis enhances systematic and parametric yield at smaller process nodes by accounting for the changes in thickness and resistance variability caused by decreasing linewidths.

Calibre CMPAnalyzerCalibre CMPAnalyzerFact SheetPDFShare

Features and Benefits

  • Report card guides you to specific check results for quick hotspot and violation analysis
  • Color maps and histograms provide global view of CMP impact on design
  • Automatic fill optimization combines planarity analysis with precise fill optimization to achieve desired results while minimizing fill shapes
  • Tight integration with Calibre xRC™ drives extremely accurate circuit simulations
  • Customized CMP models can be developed in-house using Calibre® WorkBench™
  • Ease of use: Use one menu to set up and execute simulations, analyze results and perform fill and extract operations
  • Cost effective: Use customized simulation models in-house and modify when and as needed
  • Control variability: Minimize fill shapes while still meeting planarity goals
  • Reduce time to market – Combine CMP analysis and automated fill in a single operation to reduce design iterations 
  • Production proven – Fully qualified at TSMC for specific TSMC technology data